Diamond WireTec DWS.100 Diamond Wire Saw
Diamond WireTec

Diamond WireTec DWS.100 Diamond Wire Saw

Series: DWS spool-wire saws

Model: DWS.100

horizontal two-way table saw with a maximum cutting area of 90 × 90 mm and wire speed of 0–4 m/s.

Application / measured object:

horizontal two-way table saw with a maximum cutting area of 90 × 90 mm and wire speed of 0–4 m/s.

Application area:

Product overview

The DWS.100 is a horizontal two-way table saw using the TWO-WAY-CUT process. Gravity feed maintains constant cutting pressure, while wet and dry cutting support low-damage precision sectioning of brittle, composite and temperature-sensitive materials.

Key features

  • Maximum cutting area 90 × 90 mm; suitable diamond wire 0.05–0.35 mm.
  • Adjustable wire speed 0–4 m/s with gravity feed for constant cutting pressure.
  • Colour touch control with six selectable languages, including Chinese.
  • Sensors monitor cut completion, open hood and wire condition for safe operation.
  • Stainless-steel and anodised-aluminium construction with modular workpiece holders.

Technical specifications

Machine technical specifications

Category Item Specification
Saw housing Typ Stainless steel -aluminum -construction
Safety according to European directive
Saw dimesions H 410 x L 530 x B 350 mm
Saw weight 35 kg
Drive / Power supply Engine power 120 Watt
Power supply 100-240 V / 50-60 Hz
Diamond wire Outer diameter 0,05- 0,35 mm
Wire length 20 m
Drum diameter 100 mm
Control system Operating interface color touch panel
Security code protection deactivatable
Separation Separation method Diamond wire cut
Cutting pressure Constant / gravity
Cutting speed 0 – 4 m/Sek.
Sample Max. sample weight 1 kg
Sample dimension 90 mm x 90 mm
clamping device Various sample holders
Wire cleaning Kind Mech. water swirling
Alternate Dry or air jet

Compatible diamond wires

Type Outer Ø (mm) Core wire Ø (µm) Grain size (µm) Tensile strength (N) Wire/loop length (m or mm) Minimum wheel Ø (mm)
DW.050-T 0,05 – 0,055 40 5 – 8 6 30 – 1000 40
DW.080-L 0,08 – 0,085 60 10 – 12 14 30 – 1000 40
DW.150-L 0,13 – 0,15 110 15 – 20 35 30 – 1000 60
DW.200-L 0,18 – 0,20 150 20 – 30 50 30 – 1000 80
DW.250-L 0,23 – 0,26 180 30 – 40 80 30 – 1000 80
CBN.250 0,23 – 0,26 180 30 – 40 80 30 – 1000 80
DW.250-K 0,23 – 0,26 180 30 – 40 80 30 – 1000 80
DW.350-L 0,33 – 0,36 250 40 – 50 200 30 – 1000 100
DW.350-M 0,33 – 0,35 270 30 – 40 150 30 – 120 100
CBN.350 0,33 – 0,36 250 40 – 50 200 30 – 1000 100

Applications

For precision sectioning and specimen preparation of glass, ceramics, crystals, semiconductors, geological samples, composites, metals and other brittle or temperature-sensitive materials.

Selection note

Select by material, sample dimensions, required kerf, wire diameter, cutting process and clamping needs. Final machine, wire, holder and accessory combination is subject to Labsun technical and order confirmation.