Diamond WireTec DWS.175 Diamond Wire Saw
Diamond WireTec

Diamond WireTec DWS.175 Diamond Wire Saw

Series: DWS spool-wire saws

Model: DWS.175

vertical two-way table saw with a maximum cutting area of 175 × 175 mm and wire speed of 0–4 m/s.

Application / measured object:

vertical two-way table saw with a maximum cutting area of 175 × 175 mm and wire speed of 0–4 m/s.

Application area:

Product overview

The DWS.175 is a vertical two-way table saw using the TWO-WAY-CUT process. Gravity feed maintains constant cutting pressure, while wet and dry cutting support low-damage precision sectioning of brittle, composite and temperature-sensitive materials.

Key features

  • Maximum cutting area 175 × 175 mm; suitable diamond wire 0.15–0.50 mm.
  • Adjustable wire speed 0–4 m/s with gravity feed for constant cutting pressure.
  • Colour touch control with six selectable languages, including Chinese.
  • Sensors monitor cut completion, open hood and wire condition for safe operation.
  • Stainless-steel and anodised-aluminium construction with modular workpiece holders.

Technical specifications

Machine technical specifications

Category Item Specification
Saw housing Typ Stainless steel -aluminum -construction
Safety according to European directive
Saw dimesions H 770 x L 570 x B 350 mm
Saw weight 65 kg
Drive / Power supply Engine power 120 Watt
Power supply 100-240 V / 50-60 Hz
Diamond wire Outer diameter 0,15- 0,50 mm
Wire length 30 m
Drum diameter 175 mm
Control system Operating interface color touch panel
Security code protection deactivatable
Separation Separation method Diamond wire cut
Cutting pressure Constant / gravity
Cutting speed 0 – 4 m/Sek.
Sample Max. sample weight 15 kg
Sample dimension 175 mm x 175 mm
clamping device Various sample holders
Wire cleaning Kind Mech. water swirling
Alternate Dry or air jet

Compatible diamond wires

Type Outer Ø (mm) Core wire Ø (µm) Grain size (µm) Tensile strength (N) Wire/loop length (m or mm) Minimum wheel Ø (mm)
DW.150-L 0,13 – 0,15 110 15 – 20 35 30 – 1000 60
DW.200-L 0,18 – 0,20 150 20 – 30 50 30 – 1000 80
DW.250-L 0,23 – 0,26 180 30 – 40 80 30 – 1000 80
CBN.250 0,23 – 0,26 180 30 – 40 80 30 – 1000 80
DW.250-K 0,23 – 0,26 180 30 – 40 80 30 – 1000 80
DW.350-L 0,33 – 0,36 250 40 – 50 200 30 – 1000 100
DW.350-M 0,33 – 0,35 270 30 – 40 150 30 – 120 100
CBN.350 0,33 – 0,36 250 40 – 50 200 30 – 1000 100
DW.370-K 0,35 – 0,38 280 40 – 50 230 30 – 1000 100
DW.450-L 0,43 – 0,46 350 40 – 50 280 30 – 1000 200
DW.500-L 0,48 – 0,52 400 40 – 50 320 30 – 1000 250
DW.500-M 0,49 – 0,51 400 40 – 60 250 30 – 120 100
CBN-500 0,48 – 0,52 400 40 – 50 320 30 – 1000 250

Applications

For precision sectioning and specimen preparation of glass, ceramics, crystals, semiconductors, geological samples, composites, metals and other brittle or temperature-sensitive materials.

Selection note

Select by material, sample dimensions, required kerf, wire diameter, cutting process and clamping needs. Final machine, wire, holder and accessory combination is subject to Labsun technical and order confirmation.